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Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing and Software Development 1998 edition
Way Kuo
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Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing and Software Development 1998 edition
Way Kuo
Explains reliability issues in microelectronics systems manufacturing and software development with an emphasis on evolving manufacturing technology for the semiconductor industry. This book presents ways to systematically analyze burn-in policy at the component, sub-system, and system levels.
420 pages, biography
| Medien | Bücher Gebundenes Buch (Buch mit hartem Rücken und steifem Einband) |
| Erscheinungsdatum | 31. Januar 1998 |
| ISBN13 | 9780792381075 |
| Verlag | Kluwer Academic Publishers |
| Seitenanzahl | 420 |
| Maße | 156 × 234 × 23 mm · 734 g |
| Sprache | Englisch |
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