Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier R - Cheng - Bücher - Springer Verlag, Singapore - 9789811061646 - 18. September 2017
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Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier R 1st ed. 2018 edition

Cheng

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Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier R 1st ed. 2018 edition

This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material.


137 pages, 103 Illustrations, black and white; XVIII, 137 p. 103 illus.

Medien Bücher     Buch
Erscheinungsdatum 18. September 2017
ISBN13 9789811061646
Verlag Springer Verlag, Singapore
Seitenanzahl 137
Maße 399 g

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